議程:
09:00~09:10 Opening
09:10~10:10 3D Integration, the present and the future
10:10~10:40 Break
10:40~11:40 Challenges, Trends and Solutions for 3D Interconnects in Lithography and Wafer Level Bonding Techniques.
11:40~12:00 Q & A
12:00~13:30 Lunch
13:30~14:30 Throughput Enhanced Flip-Chip to Wafer Bonding: The Advanced Chip to Wafer Bonding Process
14:30~15:00 Break
15:00~16:00 TSV Technology: Attributes, Materials, Processes and Applications
16:20~16:30 Q&A

費用：免費

聯絡窗口：591-8062 周惠珍

參考網址：http://e-pkg.itri.org.tw/memb/SeminarView.aspx?SeminarId=81

- 新聞稿有效日期，至2009/04/01為止

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