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In line with its very strong IC foundry industry, Taiwan has also developed into a pivotal position in the world’s IC packaging arena. With the number one packaging revenue generated and a promising MEMS industry sprouting, the International Microsystems, Packaging, Assembly Conference Taiwan (IMPACT), organized by the Industrial Technology Research Institute (ITRI), will be held on October 18-20, 2006 in Taiwan. The purpose of the Conference is to bring together scientists and engineers actively engaged in research and development on Microsystems as well as semiconductor packaging and assembly to discuss current progress in the field. The conference venue will be held in Grand Formosa Regent at Taipei, Taiwan. Original and unpublished papers on all aspects on microsystems, packaging, and assembly are solicited.
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Date: IMPACT October 18-20, 2006
Location: Grand Formosa Regent Taipei, Taiwan
Address: 41 Chung Shan N. Rd, Section 2, Taipei, Taiwan (ROC)
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Keynote Speakers
1.Bar-Cohen, UM,U.S.A.
2.Douglas C.H. Yu., TSMC, Taiwan
3.Masayoshi Esashi, Tohoku University, Japan
4.Andreas Ostmann, FhG-IZM, Germany
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Organized by
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, TAIWAN Technical sponsors by
ADVANCED MICROSYSTEMS AND PACKAGING TECHNOLOGY ALLIANCE, TAIWAN
FRAUNHOFER INSTITUT ZUVERLASSIGKEIT UND MIKROINTEGRATION, GERMANY
IEEE COMPONENTS, PACKAGING, & MANUFACTURING TECHNOLOGY SOCIETY
INTERNATIONAL MICROELECTRONICS AND PACKAING SOCIETY (TAIWAN)
THE SURFACE MOUNT TECHNOLOGY ASSOICATION (TAIWAN)
AMERICAN SOCIETY OF MECHANICAL ENGINEERS
TAIWAN SEMICONDUCTOR INDUSTRY ASSOCIATION
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Inquires
Requests for information about the Symposia should be directed to: Emily Shen
Symposia Secretariat
195, Sec. 4, Chung Hsing Road
Chutung, Hsinchu, Taiwan.
Tel: +886-3-591 2029
Fax: +886-3-582 0221
E-mail: impact@itri.org.tw
- 新聞稿有效日期，至2006/08/17為止
聯絡人 ：Emily
聯絡電話：+886-3-5912029
電子郵件：impact@itri.org.tw
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